What are the introductions to the common sense of seal purchase?

Epoxy modified one-component product
1 density ranging from 1.1 to 2.8, curing time is 50 degrees / 4 hours or 110 degrees / 30 minutes or 110 degrees / 50 minutes;
2 With moderate thixotropy, the electronic components can be covered and wrapped on the circuit board. The glue can self-level, but it does not flow, and does not flow during the baking and curing process, maintaining the original shape;
3 cured product black or amber bright, strong adhesion to the circuit board and electronic components, and can withstand 200-300 ° C high temperature and strong acid and alkali corrosion and resistance to various solvent erosion;
4High bonding strength, good heat resistance, excellent solvent resistance, adhesion can be achieved by device damage, temperature resistance and device damage. Cured materials are not attacked by professional solvents, making circuits and electronics The components are advantageously protected against technical leaks inside the device;
5 This product is suitable for the secret potting of electronic devices. It has strong solvent resistance after curing and can withstand long-term immersion of organic solvents. It has extremely high heat distortion temperature and can resist high temperature damage. It also has good hardness and resistance. Abrasive, resistant to etched damage of general cutting tools.
6 Using this product to encapsulate electronic circuits, it has excellent anti-decryptability.
7 This product is easy to use, long storage period, high bonding strength, fast curing speed, low shrinkage, non-toxic and harmless.
8 Store at room temperature for 70 days, and store in refrigerator for more than half a year.